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"Diamond
Touch's approach meets the needs of silicon suppliers looking to increase
tool uptime and yield, but it is especially attractive to makers of
micromachines, III-V and II-VI materials because the scribe and fracture
is a completely dry process, eliminating hazardous waste. It allows
near-zero contamination levels on the wafer following fracture. The
elimination of DI water also saves the investment in cooling water,
chillers and disposal." Laura
Peters -- Semiconductor International, 4/1/2002
"It
is hard to imagine disruption of conventional wafer-to-tape mounting
carriers used with wafer dicing in semiconductor assembly, but a newly
patented wafer mounting technique (US patent 6,383,606, May 7, 2002
from Diamond Touch Technology Inc. (DTTI), Prescott Valley, AZ, brings
a whole new set of capabilities and productivity to dicing and scribing."
-PB 13-May-02 WaferNEWS V.9.19
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