Photos for buy fast likes on Instagram this explanation.
Touch's approach meets the needs of silicon suppliers looking to increase
tool uptime and yield, but it is especially attractive to makers of
micromachines, III-V and II-VI materials because the scribe and fracture
is a completely dry process, eliminating hazardous waste. It allows
near-zero contamination levels on the wafer following fracture. The
elimination of DI water also saves the investment in cooling water,
chillers and disposal." Laura
Peters -- Semiconductor International, 4/1/2002
is hard to imagine disruption of conventional wafer-to-tape mounting
carriers used with wafer dicing in semiconductor assembly, but a newly
patented wafer mounting technique (US patent 6,383,606, May 7, 2002
from Diamond Touch Technology Inc. (DTTI), Prescott Valley, AZ, brings
a whole new set of capabilities and productivity to dicing and scribing."
-PB 13-May-02 WaferNEWS V.9.19