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Scribe
& Fracture Systems Die
Separation Machine:
Innovative scribe and separation solution. Modular design, separates
die on 2" (50 mm), -4" (100 mm), -6" (150 mm),
-8" (200 mm) wafers. Upgrade wafer size to 300 mm at minimal
cost. Composite construction. Table Top. Anit-Vibration Floor
Stands available. Throughput improvement to 400%!
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Patented Wafer
Mounting DiaFrame©®
Scribe
& Fracture Pictures. Click image for larger view.
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DiaFrame©®
The heart of the die separation systems is our Patented, DiaFrame
wafer carrier. This patiented carrier permits the entire fracture
process to occur on the chuck with no reheating or stretching of
the media. The DiaFrame is a slightly domed surface which flattens
when an unfractured wafer is mounted. When the scribing is completed
a Fracture Puff of high velocity air is released under the DiaFrame
(though the chuck). This causes all the fractures to occur along
scribe lines simultaneously, significantly increasing yields and
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Anti-Vibration
Patented VMP-DS Floor Stand: Varable Cell Composite constructed
technology gives an isolation Q of 1.65 and no third order harmonics.
Combined with Tri-leg support the unit provides the proven isolation
and stability for our die separation systems.
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Diamond
Touch's New Saws: Modular
designed, MTBF of >2500 hours, upgradable from 200 to 300 mm,
composite construction base Dicing Saws.
Table Top and Floor models available. |
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Re-engineered
Saws Renovating
a dicing saw that incorporates current computer technology coupled
with innovative software engineering to meet and exceed your
expectations.
BEST
VALUE! One
year warranty!
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Replacement Hardware for K&S and Disco
Saws
We carry
in stock many replacements or re-designed replacements.
New Spindles,
Spindle Repair & Rebuilt Spindles:
Sales and Service Center for spindle service and replacement for
Disco, MTI, and K&S Air Bearing Spindles
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