|
| SPECIFICATIONS
|
|
| Movement
and Accuracy |
| Y Axis |
| Total
Motion |
|
8.27
to 12 inch (option) |
| Index
Repeatability |
|
.25
um |
| Accumulative
Error |
|
None
|
| Minimum
Index |
|
.25
um |
|
| X
Axis |
| Repeatability
|
|
.25
um |
| Accumulative
Error |
|
None
|
| Return
Speed Max |
|
12
inches/Sec. |
| Z
Axis |
| Repeatability
|
|
.25
um |
| Accumulative
Error |
|
None
|
| Theta
Axis Rotation |
|
>360
Degrees
+/- 2 arc seconds |
|
| Scribe Tool |
| Scribe
Tool |
|
Diamond
tip |
| Angle of
Attack |
|
<
2 degrees computer programmable |
| Tip pressure
Control & Resolution |
|
Resolution: 0.01
gm
Range: 5 gm-150 gm
Repeatability:
+/- 0.1 gm with Z-1 movement of
0.050 inch
Positioned w/Air Bearing
Slide |
| Pressure
Readout |
|
Realtime
display |
|
 |
|
|
|
Welcome
to a new advanced Scribe & Frature system designed from
the ground up to improve process throughput, yield, accuracy
and reliability using a dustless, water-free process.
How it works:
A wafer is mounted on a Diamond Touch patented DiaFrame(tm)
wafer carrier.
Using the Diamond Touch DS scribing machine
or, in the case of very hard surfaces such as silicon carbide,
a DS saw, the wafer is scribed, causing a micro-seed fracture
approximately 4-10 um deep below each scribe line.
A metered puff of clean air through the pourous
chuck causes the DiaFrame(tm) to return to its relaxed,
domed shape and, at supersonic speed, fractures all
the scribe lines
along each scribe line.
Scribe
& Fracture Microphotographs. Click image for larger view.
System description
The
entire system has been designed with off-the-shelf components.
Standard Intel- based microprocessors, stepper motors and
even the power supplies. Inherent incorporation of hardware
plug and play service eases service and results in highest
available MTBF (>2500 hours) and shortest MTTR (<2.5 hours).
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Chuck table Vacuum hold down
for Diamond Touch Wafer Mount
DiaFrame used with 4-, 6- and 8-inch wafers
Work chuck sizes:
4" (100 mm), 6" (150 mm), 8" (200 mm). To
300mm
Video microscope and Color
camera subsystem 120X or greater displaying 12.1" Color
Flat Panel Display with a dual line B/W reticle generator
Solid state hard drives Replaces
mechanical devices and assures increased reliability
Software interfaces Color-FPD
Password protection
Log and event file Available on display, 3 1/2" floppy
or on LAN for all wafers processed
Self-diagnostic routines Displayed
and reported on LAN and 3 1/2" floppy in real time
and in historical reporting
Axis speed programming Individually,
independent
Command & control functions
Entry through color-FPD touch-screen
Programmable off-line software
Included, download 3 ½ diskette or direct communications
of the fab LAN.
Facilities
Vacuum 20 in Hg minimum
Air Pressure 80 PSIG +/- 10 PSI
Air Flow Rate: <1 CFM
Air Purity <5 Micron
Ambient Temperature 50-80 Degrees F
General
Dimensions 31" W 32"D 24"H
Weight 800 Lbs.
Power 110 VAC 50/60 Hz
Current 20 Amps
|
